罗斌森
  • TPS65921B1ZQZ

  • Manufacturer : Texas Instruments
    Packaging : Bulk
    Alternate Packaging
    Part Status : Active
    Applications : Handheld/Mobile Devices, OMAP?
    Current - Supply : 300μA
    Voltage - Supply : 2.7V ~ 4.5V
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 120-VFBGA
    Supplier Device Package : 120-BGA Microstar Junior (6x6)

极速报价

型号
品牌 封装 批号 查看
PT5109A TI New 详细
CSD25303W1015 TI 6-DSBGA (1x1.5) New 详细
DAC7641Y/250 TI 32-TQFP (5x5) New 详细
MSP430F2370IYFFR TI 49-DSBGA (2.8x2.8) New 详细
SN74LV166APW TI 16-TSSOP New 详细
LM5576MH/NOPB TI 20-HTSSOP New 详细
LM3S9781-IQC80-C5T TI 100-LQFP (14x14) New 详细
LM224KDE4 TI 14-SOIC New 详细
LM3S2918-IBZ50-A2T TI 108-BGA (10x10) New 详细
SN74LV4051ATPWRQ1 TI 16-TSSOP New 详细
LP2982IM5-3.3/NOPB TI SOT-23-5 New 详细
TLK2201ARCPR TI 64-HVQFP New 详细
REF2030AIDDCR TI SOT-23-5 New 详细
TLV71210DSET TI 6-WSON (1.5x1.5) New 详细
SN74ABT16657DLR TI 56-SSOP New 详细
UC2709DW TI 16-SOIC New 详细
OMAPL132DZWTA2 TI 361-NFBGA (16x16) New 详细
LP2950CZ-5.0/T1 TI TO-92-3 New 详细
74LVC16646ADGVRE4 TI 56-TVSOP New 详细
TL2575-05IKV TI TO-220-5 New 详细