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  • TLV4110IDGNR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 1
    Output Type : Rail-to-Rail
    Slew Rate : 1.57V/μs
    Gain Bandwidth Product : 2.7MHz
    Current - Input Bias : 0.3pA
    Voltage - Input Offset : 175μV
    Current - Supply : 700μA
    Current - Output / Channel : 320mA
    Voltage - Supply, Single/Dual (±) : 2.5V ~ 6V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 8-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
LMH1226RTWT TI 24-WQFN (4x4) New 详细
LM3S328-IQN25-C2T TI 48-LQFP (7x7) New 详细
CC1125DK TI New 详细
TLC070CDGN TI 8-MSOP-PowerPad New 详细
TLV320AIC3268IRGCT TI 64-VQFN (9x9) New 详细
LP38512MR-ADJ/NOPB TI 8-SO PowerPad New 详细
LM4941SD/NOPB TI 8-WSON (3x2.5) New 详细
TLVH431BQDCKR TI SC-70-6 New 详细
CSD87502Q2T TI 6-WSON (2x2) New 详细
TL720M05QPWPRQ1 TI 20-HTSSOP New 详细
FCT162H245ATPVCTG4 TI 48-SSOP New 详细
DS25BR120TSD/NOPB TI 8-WSON (3x3) New 详细
OPA3875IDBQ TI 16-SSOP New 详细
MC33078DGKR TI 8-VSSOP New 详细
REG102UA-3 TI 8-SOIC New 详细
ADS5517EVM TI New 详细
ADC10154CIWM TI 24-SOIC New 详细
NE5532APSR TI 8-SO New 详细
SN74LV373ARGYR TI 20-VQFN (3.5x4.5) New 详细
TMS320DM355DZCE27J TI 337-NFBGA (13x13) New 详细