产品系列
TMS5704357BZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R5F
Core Size : 32-Bit
Speed : 300MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 145
Program Memory Size : 4MB (4M x 8)
Program Memory Type : FLASH
EEPROM Size : 128K x 8
RAM Size : 512K x 8
Voltage - Supply (Vcc/Vdd) : 3V ~ 3.6V
Data Converters : A/D 41x12b
Oscillator Type : Internal
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM3524DMX | TI | 16-SOIC | New | 详细 | |
| SN74LV86APW | TI | 14-TSSOP | New | 详细 | |
| SN74AS1034ANSRE4 | TI | 14-SOP | New | 详细 | |
| TMS320C5535AZHHA10 | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| PT78NR110ST | TI | New | 详细 | ||
| PCI1510GGU | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| LM2655MTCX-ADJ | TI | 16-TSSOP | New | 详细 | |
| LM2593HVS-ADJ | TI | DDPAK/TO-263-7 | New | 详细 | |
| UCC28084PW | TI | 8-TSSOP | New | 详细 | |
| LM2671N-12/NOPB | TI | 8-PDIP | New | 详细 | |
| ADS1260BIRHBR | TI | 32-VQFN (5x5) | New | 详细 | |
| UCC3813PW-2 | TI | 8-TSSOP | New | 详细 | |
| TPA3001D1EVM | TI | New | 详细 | ||
| LM6142BIMX | TI | 8-SOIC | New | 详细 | |
| SN74CBTD3861DBQR | TI | 24-SSOP/QSOP | New | 详细 | |
| ADS5103CPFBG4 | TI | 48-TQFP (7x7) | New | 详细 | |
| TMS320DM643AGDK6 | TI | 548-FC/CSP (23x23) | New | 详细 | |
| SN65LVPE502BRGER | TI | 24-VQFN (4x4) | New | 详细 | |
| UCC27533DBVR | TI | SOT-23-5 | New | 详细 | |
| SN74LVC823ADBR | TI | New | 详细 |
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