产品系列
TMS5703137DZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Active
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| DS25CP152TSQ/NOPB | TI | 16-WQFN (4x4) | New | 详细 | |
| LF412CD | TI | 8-SOIC | New | 详细 | |
| SN74AHCT32DR | TI | 14-SOIC | New | 详细 | |
| LP3964EMPX-ADJ/NOPB | TI | SOT-223-5 | New | 详细 | |
| UCC28C42D | TI | 8-SOIC | New | 详细 | |
| TLV1117IKCS | TI | TO-220-3 | New | 详细 | |
| LP2988AIMM-2.7 | TI | 8-VSSOP | New | 详细 | |
| LP38843S-1.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| CD74HCT574QM96Q1 | TI | New | 详细 | ||
| LMP7717MF/NOPB | TI | SOT-23-5 | New | 详细 | |
| PCM1702U | TI | 20-SO | New | 详细 | |
| TLVH431BIDCKT | TI | SC-70-6 | New | 详细 | |
| ADC121S101CIMF/NOPB | TI | SOT-23-6 | New | 详细 | |
| BQ29441DRBT | TI | 8-SON (3x3) | New | 详细 | |
| UCC2839DG4 | TI | 14-SOIC | New | 详细 | |
| INA303A2IPW | TI | 14-TSSOP | New | 详细 | |
| LM4861M/NOPB | TI | 8-SOIC | New | 详细 | |
| SN74ALVTH16821DLR | TI | New | 详细 | ||
| MSP430FR59891IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| CD74HCT123E | TI | 16-PDIP | New | 详细 |
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