产品系列
TMS5703137BZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 180MHz
Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 120
Program Memory Size : 3MB (3M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| 74ABTH162460DGGRG4 | TI | 56-TSSOP | New | 详细 | |
| LP3995ILD-3.0/NOPB | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| SN74AS21NSR | TI | 14-SOP | New | 详细 | |
| LP38852MRX-ADJ/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| DRV10987SPWPR | TI | 24-HTSSOP | New | 详细 | |
| BQ25896RTWT | TI | 24-WQFN (4x4) | New | 详细 | |
| ADC121S101CIMFX/NOPB | TI | SOT-23-6 | New | 详细 | |
| LM3S1911-IBZ50-A2T | TI | 108-BGA (10x10) | New | 详细 | |
| INA219AIDCNRG4 | TI | New | 详细 | ||
| TAS5026PAGR | TI | 64-TQFP (10x10) | New | 详细 | |
| UC385TDKTTT-1 | TI | DDPAK/TO-263-5 | New | 详细 | |
| PT6643P | TI | New | 详细 | ||
| LM2772SD | TI | 10-WSON (3x3) | New | 详细 | |
| LM4041QDIM3-ADJ/NO | TI | SOT-23-3 | New | 详细 | |
| TRS207IDWG4 | TI | 24-SOIC | New | 详细 | |
| SN74ABT7819A-10PN | TI | 80-LQFP (12x12) | New | 详细 | |
| LM3S9971-IQC80-C3T | TI | 100-LQFP (14x14) | New | 详细 | |
| LP2988IMM-2.5 | TI | 8-VSSOP | New | 详细 | |
| TPD2E001IDRLRQ1 | TI | SOT-5 | New | 详细 | |
| LM3880QMFE-1AD/NOPB | TI | SOT-23-6 | New | 详细 |
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