产品系列
TMS5702135CPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 58
Program Memory Size : 2MB (2M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 256K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| REG710NA-2.5/3KG4 | TI | SOT-23-6 | New | 详细 | |
| TPA3136AD2PWPR | TI | 20-HTSSOP | New | 详细 | |
| LMC6082AIMX/NOPB | TI | 8-SOIC | New | 详细 | |
| TMS470R1A128PZ | TI | 100-LQFP (14x14) | New | 详细 | |
| LP875640RNFRQ1 | TI | New | 详细 | ||
| TPA6100A2DR | TI | 8-SOIC | New | 详细 | |
| ADS8284IBRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| MSP430F110IPWR | TI | 20-TSSOP | New | 详细 | |
| LP38502ASD-ADJ/NOPB | TI | 8-WSON (3x2.5) | New | 详细 | |
| BQ2003PN | TI | 16-PDIP | New | 详细 | |
| PT6705N | TI | New | 详细 | ||
| OPA2344EA/2K5 | TI | 8-VSSOP | New | 详细 | |
| TL16C554FN | TI | 68-PLCC (24.23x24.23) | New | 详细 | |
| LM4050QBIM3X4.1/NOPB | TI | SOT-23-3 | New | 详细 | |
| TPS40170QRGYRQ1 | TI | 20-VQFN (3.5x4.5) | New | 详细 | |
| TPS2412PW | TI | 8-TSSOP | New | 详细 | |
| LM2671M-ADJ | TI | 8-SOIC | New | 详细 | |
| UCC38083PWG4 | TI | 8-TSSOP | New | 详细 | |
| CD74ACT573M96 | TI | 20-SOIC | New | 详细 | |
| BQ24172RGYR | TI | 24-VQFN (5.5x3.5) | New | 详细 |
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