产品系列
TMS5701224BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 1.25MB (1.25M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 192K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| CLC5957MTDX/NOPB | TI | 48-TSSOP | New | 详细 | |
| SM320VC5421PGE20EP | TI | 144-LQFP (20x20) | New | 详细 | |
| WL1837MODGIMOCT | TI | New | 详细 | ||
| TLV70013DDCR | TI | SOT-23-5 | New | 详细 | |
| TPA6204A1DRBR | TI | 8-SON (3x3) | New | 详细 | |
| TL-SCSI285PWRE4 | TI | 20-TSSOP | New | 详细 | |
| LP5910-0.9YKAR | TI | 4-DSBGA | New | 详细 | |
| LM25088MHX-2/NOPB | TI | 16-HTSSOP | New | 详细 | |
| DF1706E/2KG4 | TI | 28-SSOP | New | 详细 | |
| LM3S3N26-IQR50-C3T | TI | 64-LQFP (10x10) | New | 详细 | |
| LM2575N-ADJ/NOPB | TI | 16-DIP | New | 详细 | |
| SN74AHC245NSR | TI | 20-SO | New | 详细 | |
| THS9000DRDR | TI | 6-VSON (2x2) | New | 详细 | |
| TLC7733IPWR | TI | 8-TSSOP | New | 详细 | |
| LM385BM-1.2/NOPB | TI | 8-SOIC | New | 详细 | |
| DRV8801QRTYRQ1 | TI | 16-QFN (3x4) | New | 详细 | |
| TLV5619QDWREP | TI | 20-SOIC | New | 详细 | |
| LM12458CIVX/NOPB | TI | 44-PLCC (16.58x16.58) | New | 详细 | |
| TPS62100DR | TI | 8-SOIC | New | 详细 | |
| LP2992IM5X-1.8/NOPB | TI | SOT-23-5 | New | 详细 |
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