产品系列
TMS5701114BPGEQQ1
- Manufacturer : Texas Instruments
Packaging : Tray
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 16/32-Bit
Speed : 160MHz
Connectivity : CANbus, EBI/EMI, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 1MB (1M x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| REF102AU | TI | 8-SOIC | New | 详细 | |
| DAC8775IRWFT | TI | 72-VQFN (10x10) | New | 详细 | |
| LM2734XMKX/NOPB | TI | TSOT-23-6 | New | 详细 | |
| LMV358AIDGKT | TI | 8-VSSOP | New | 详细 | |
| SN74AS374N | TI | New | 详细 | ||
| TPS53661RSBT | TI | 40-WQFN (5x5) | New | 详细 | |
| DS8922MX | TI | 16-SOIC | New | 详细 | |
| UCC28086PW | TI | 8-TSSOP | New | 详细 | |
| TPIC6A259NE | TI | 20-PDIP | New | 详细 | |
| LMV225SD/NOPB | TI | 6-WSON (2.5x2.2) | New | 详细 | |
| LP8340ILDX-2.5 | TI | 6-WSON (2.92x3.29) | New | 详细 | |
| CY74FCT373ATSOC | TI | 20-SOIC | New | 详细 | |
| MSP430F1612IPM | TI | 64-LQFP (10x10) | New | 详细 | |
| TPS22922YZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| DAC8163SDSCR | TI | 10-WSON (3x3) | New | 详细 | |
| SN74AUC1G04YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 详细 | |
| TPS7A8001DRBT | TI | 8-SON (3x3) | New | 详细 | |
| SN74LV74ADBR | TI | New | 详细 | ||
| TPS2552DBVT-1 | TI | SOT-23-6 | New | 详细 | |
| TMS320F2801ZGMS | TI | 100-BGA MICROSTAR (10.1x10.1) | New | 详细 |
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