罗斌森
罗斌森
  • TPS55010RTET

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Function : Step-Up/Step-Down
    Output Configuration : Positive or Negative, Isolation Capable
    Topology : Flyback
    Output Type : Adjustable
    Number of Outputs : 1
    Voltage - Input (Min) : 2.98V
    Voltage - Input (Max) : 6V
    Voltage - Output (Min/Fixed) : 3.3V
    Voltage - Output (Max) : 20V
    Frequency - Switching : 100kHz ~ 2MHz
    Synchronous Rectifier : Yes
    Operating Temperature : -40°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 16-WFQFN Exposed Pad
    Supplier Device Package : 16-WQFN (3x3)

极速报价

型号
品牌 封装 批号 查看
CSD18535KTT TI DDPAK/TO-263-3 New 详细
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TPS23523PWT TI 16-TSSOP New 详细
LM3S5P36-IQR80-C0T TI 64-LQFP (10x10) New 详细
TPS7A0531PDBVR TI SOT-23-5 New 详细
LM3S3Z26-IQR50-C5T TI 64-LQFP (10x10) New 详细
MSP430FR5728IPW TI 28-TSSOP New 详细
AMC1301QDWVRQ1 TI 8-SOIC New 详细
LM1247AAG/NA TI 24-DIP New 详细
UCC2917DTRG4 TI 16-SOIC New 详细
TPS3831G12DQNR TI 4-X2SON (1x1) New 详细
TLC081IDGNR TI 8-MSOP-PowerPad New 详细
SN64BCT25244DWRE4 TI 24-SOIC New 详细
MSP432P4011IRGCT TI 64-VQFN (9x9) New 详细
LM3S1H16-IQR50-A1 TI 64-LQFP (10x10) New 详细
BQ4010YMA-85N TI 28-DIP Module (18.42x37.72) New 详细
BQ4011MA-200 TI 28-DIP Module (18.42x37.72) New 详细
TMS320C6711BGFN150 TI 256-BGA (27x27) New 详细
AFE5803ZCF TI 135-NFBGA (15x9) New 详细
PCM3793ARHBR TI 32-VQFN (5x5) New 详细
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