产品系列

罗斌森
  • TMX5703137BZWTQQ1

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
    Part Status : Discontinued at Digi-Key
    Core Processor : ARM? Cortex?-R4F
    Core Size : 16/32-Bit
    Speed : 180MHz
    Connectivity : CANbus, EBI/EMI, Ethernet, FlexRay, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
    Peripherals : DMA, POR, PWM, WDT
    Number of I/O : 120
    Program Memory Size : 3MB (3M x 8)
    Program Memory Type : FLASH
    EEPROM Size : 64K x 8
    RAM Size : 256K x 8
    Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
    Data Converters : A/D 24x12b
    Oscillator Type : External
    Operating Temperature : -40°C ~ 125°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 337-LFBGA
    Supplier Device Package : 337-NFBGA (16x16)

极速报价

型号
品牌 封装 批号 查看
MAX3223IDBR TI 20-SSOP New 详细
BQ7693006DBT TI 30-TSSOP New 详细
SN74AC574DW TI New 详细
TLE2142AID TI 8-SOIC New 详细
LMR14050SSQDDARQ1 TI 8-SO PowerPad New 详细
SN74LVC8T245NSR TI 24-SO New 详细
TRS3222EIDW TI 20-SOIC New 详细
LPV324MTX TI 14-TSSOP New 详细
TPS259541DSGR TI 8-WSON (2x2) New 详细
PCM1789PW TI 24-TSSOP New 详细
LM3475MF/NOPB TI SOT-23-5 New 详细
SN74AHC1G86MDCKREP TI SC-70-5 New 详细
UC3525BDW TI 16-SOIC New 详细
ISOW7821FDWE TI 16-SOIC New 详细
LM36274YFFR TI 24-DSBGA New 详细
LP5907UVX-1.6/NOPB TI 4-DSBGA New 详细
LP3856ES-1.8 TI DDPAK/TO-263-5 New 详细
SN74ALS1245ADWRG4 TI 20-SOIC New 详细
SN74CB3T16211ZQLR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
DK-LM3S101 TI New 详细