产品系列
TMX5700714ZWTQQ1
- Manufacturer : Texas Instruments
Packaging : Bulk
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 32-Bit Dual-Core
Speed : 180MHz
Connectivity : CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 101
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 337-LFBGA
Supplier Device Package : 337-NFBGA (16x16)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TMS320DM6467TCUTD1 | TI | 529-FCBGA (19x19) | New | 详细 | |
| TPS54325PWPR | TI | 14-HTSSOP | New | 详细 | |
| TPS73115DBVR | TI | SOT-23-5 | New | 详细 | |
| LM4041CEM3-ADJ/NOPB | TI | SOT-23-3 | New | 详细 | |
| TSC2301IGQZ | TI | 120-BGA Microstar Junior (6x6) | New | 详细 | |
| TRS3223EIDBR | TI | 20-SSOP | New | 详细 | |
| TAS5414BTDKDRQ1 | TI | 36-HSSOP | New | 详细 | |
| TPS54233EVM-373 | TI | New | 详细 | ||
| LP3856ESX-2.5 | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74ALS04BDBR | TI | 14-SSOP | New | 详细 | |
| AM26LV32EMDREP | TI | 16-SOIC | New | 详细 | |
| LM26003MH/NOPB | TI | 20-HTSSOP | New | 详细 | |
| TLV4120IDGNR | TI | 8-MSOP-PowerPad | New | 详细 | |
| LP38843SX-1.2/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| OPA188AIDR | TI | 8-SOIC | New | 详细 | |
| SN74LV244ADW | TI | 20-SOIC | New | 详细 | |
| LM2592HVSX-3.3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TRSF3223CDWR | TI | 20-SOIC | New | 详细 | |
| SN761664DBTR | TI | 38-TSSOP | New | 详细 | |
| SN74ABT533ADWRG4 | TI | 20-SOIC | New | 详细 |
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