产品系列
TMX5700714PGEQQ1
- Manufacturer : Texas Instruments
Packaging : Bulk
Series : Automotive, AEC-Q100, Hercules? TMS570 ARM? Cortex?-R
Part Status : Obsolete
Core Processor : ARM? Cortex?-R4F
Core Size : 32-Bit Dual-Core
Speed : 160MHz
Connectivity : CANbus, I2C, LINbus, MibSPI, SCI, SPI, UART/USART
Peripherals : DMA, POR, PWM, WDT
Number of I/O : 64
Program Memory Size : 768KB (768K x 8)
Program Memory Type : FLASH
EEPROM Size : 64K x 8
RAM Size : 128K x 8
Voltage - Supply (Vcc/Vdd) : 1.14V ~ 3.6V
Data Converters : A/D 24x12b
Oscillator Type : External
Operating Temperature : -40°C ~ 125°C (TA)
Mounting Type : Surface Mount
Package / Case : 144-LQFP
Supplier Device Package : 144-LQFP (20x20)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2990S-5.0/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| LMX2592RHAT | TI | 40-VQFN (6x6) | New | 详细 | |
| SN74HC590ADWR | TI | 16-SOIC | New | 详细 | |
| SN74LVCH16540ADL | TI | 48-SSOP | New | 详细 | |
| THS6092CDR | TI | 8-SOIC | New | 详细 | |
| TLV62095RGTT | TI | 16-VQFN (3x3) | New | 详细 | |
| SN75ALS180D | TI | 14-SOIC | New | 详细 | |
| LM57BISDX-5/NOPB | TI | 8-WSON (2.5x2.5) | New | 详细 | |
| DLP9000FLS | TI | 355-CLGA (42.2x42.2) | New | 详细 | |
| LM2672MX-12 | TI | 8-SOIC | New | 详细 | |
| MSP430G2221IN14 | TI | 14-PDIP | New | 详细 | |
| BQ21040EVM-777 | TI | New | 详细 | ||
| LM22676QMR-ADJ/NOPB | TI | 8-SO PowerPad | New | 详细 | |
| TPS51275CRUKT | TI | 20-WQFN (3x3) | New | 详细 | |
| UC2856DW | TI | 16-SOIC | New | 详细 | |
| TPS40041DRBR | TI | 8-SON (3x3) | New | 详细 | |
| TPS2370PWR | TI | 8-TSSOP | New | 详细 | |
| ADS6425EVM | TI | New | 详细 | ||
| LM2574N-12 | TI | 8-PDIP | New | 详细 | |
| TPS79301DBVT | TI | SOT-23-6 | New | 详细 |
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