产品系列

罗斌森
  • TMS320C6203BGNZ173

  • Manufacturer : Texas Instruments
    Packaging : Tray
    Series : TMS320C62x
    Part Status : Obsolete
    Type : Fixed Point
    Interface : McBSP
    Non-Volatile Memory : External
    On-Chip RAM : 896kB
    Voltage - I/O : 3.30V
    Voltage - Core : 1.50V
    Operating Temperature : 0°C ~ 90°C (TC)
    Mounting Type : Surface Mount
    Package / Case : 352-BBGA, FCBGA
    Supplier Device Package : 352-FCBGA (27x27)

极速报价

型号
品牌 封装 批号 查看
TMS320DM641AGNZ5 TI 548-FCBGA (27x27) New 详细
SN74LV10ADBRG4 TI 14-SSOP New 详细
TLVH431AQDCKR TI SC-70-6 New 详细
INA132U TI 8-SOIC New 详细
LM3S6916-IBZ50-A2T TI 108-BGA (10x10) New 详细
TPS79330DBVR TI SOT-23-5 New 详细
SN74ALVCH162836VR TI 56-TVSOP New 详细
SN74LVCH245APWT TI 20-TSSOP New 详细
TPS61032EVM-208 TI New 详细
PCA9554APW TI 16-TSSOP New 详细
TPS77515PWP TI 20-HTSSOP New 详细
TLC2272IPW TI 8-TSSOP New 详细
LP5990UMX-1.8/NOPB TI 4-DSBGA (0.81x0.81) New 详细
LM336M-5.0/NOPB TI 8-SOIC New 详细
CD4504BPWR TI 16-TSSOP New 详细
FDC2112DNTT TI 12-DFN (4x4) New 详细
LM3S3826-IQR50-C0 TI 64-LQFP (10x10) New 详细
UC382TDKTTT-1G3 TI DDPAK/TO-263-5 New 详细
PGA4311UA TI 28-SOIC New 详细
74AC11086DRG4 TI 16-SOIC New 详细