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罗斌森
  • TLV2782CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 5V/μs
    Gain Bandwidth Product : 8MHz
    Current - Input Bias : 2.5pA
    Voltage - Input Offset : 250μV
    Current - Supply : 650μA
    Current - Output / Channel : 23mA
    Voltage - Supply, Single/Dual (±) : 1.8V ~ 3.6V, ±0.9V ~ 1.8V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
RM46L440ZWTT TI 337-NFBGA (16x16) New 详细
THS770012IRGET TI 24-VQFN (4x4) New 详细
MM5483N/NOPB TI 40-DIP New 详细
SN74CBTLV3861DGVR TI 24-TVSOP New 详细
LM2623MMX/NOPB TI 8-VSSOP New 详细
SN74HC684DW TI New 详细
LMR14203XMK/NOPB TI TSOT-23-6 New 详细
DS89C21TMX TI 8-SOIC New 详细
TPS40170EVM-597 TI New 详细
TPS65835RKPR TI 40-VQFN-EP (5x5) New 详细
DP83936AVUL-33 TI 160-PQFP (28x28) New 详细
SN74ALVCH16374KR TI New 详细
LM4125IM5-2.5 TI SOT-23-5 New 详细
LP3995ITL-1.5/NOPB TI 5-DSBGA (1.41x1.08) New 详细
TMS320C6454BZTZ8 TI 697-FCBGA (24x24) New 详细
THS1206IDA TI 32-TSSOP New 详细
LM317AT TI TO-220-3 New 详细
LM2795BL/NOPB TI 14-DSBGA New 详细
LP3964ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
SN74LV245AGQNR TI 20-BGA MICROSTAR JUNIOR (4x3) New 详细