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罗斌森
  • TLV2475CDR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 4
    Output Type : Rail-to-Rail
    Slew Rate : 1.5V/μs
    Gain Bandwidth Product : 2.8MHz
    Current - Input Bias : 2.5pA
    Voltage - Input Offset : 250μV
    Current - Supply : 600μA
    Current - Output / Channel : 35mA
    Voltage - Supply, Single/Dual (±) : 2.7V ~ 6V, ±1.35V ~ 3V
    Operating Temperature : 0°C ~ 70°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
TLV2460QPWR TI 8-TSSOP New 详细
MSP430FR5724IPW TI 28-TSSOP New 详细
LM25117PSQ/NOPB TI 24-WQFN (4x4) New 详细
LM4991MAX/NOPB TI 8-SOIC New 详细
DAC38RF83IAAV TI 144-FCBGA (10x10) New 详细
LM5000SDX-6 TI 16-WSON (5x5) New 详细
SN74LVTH573IPWREP TI 20-TSSOP New 详细
SN74LVC86APWR TI 14-TSSOP New 详细
TXS0102DQER TI 8-X2SON (1.4x1.0) New 详细
OMAPL138AZCEA3 TI 361-NFBGA (13x13) New 详细
OPA1604AID TI 14-SOIC New 详细
CC3120RNMARGKR TI 64-VQFN (9x9) New 详细
SN74LV374ATRGYR TI New 详细
SN74LS21NS TI New 详细
DM385AAAR21 TI 609-FCBGA (16x16) New 详细
LP3470IM5-2.63/NOPB TI SOT-23-5 New 详细
TPA4411YZHR TI 16-DSBGA (2.24x2.16) New 详细
LMZ23605DEMO/NOPB TI New 详细
SE555P TI 8-PDIP New 详细
DAC8871EVM TI New 详细