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罗斌森
  • TLC2272AMDG4

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Series : LinCMOS?
    Part Status : Active
    Amplifier Type : General Purpose
    Number of Circuits : 2
    Output Type : Rail-to-Rail
    Slew Rate : 3.6V/μs
    Gain Bandwidth Product : 2.25MHz
    Current - Input Bias : 1pA
    Voltage - Input Offset : 300μV
    Current - Supply : 2.4mA
    Current - Output / Channel : 50mA
    Voltage - Supply, Single/Dual (±) : 4.4V ~ 16V, ±2.2V ~ 8V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

极速报价

型号
品牌 封装 批号 查看
LP3876ES-2.5/NOPB TI DDPAK/TO-263-5 New 详细
TRF37C75IDSGR TI 8-WSON (2x2) New 详细
TLVH431BQDBZT TI SOT-23-3 New 详细
SN74ALB16244DGVR TI 48-TVSOP New 详细
PCA9518PWR TI 20-TSSOP New 详细
78HT253HC TI New 详细
TL2575HV-15IKV TI TO-220-5 New 详细
OMAPL137BPTPH TI 176-HLQFP (24x24) New 详细
SN74LVC2G157DCTR TI SM8 (SSOP) New 详细
OPA4364AQDRQ1 TI 14-SOIC New 详细
TLC541INSG4 TI 20-SO New 详细
CD74HC4075M TI 14-SOIC New 详细
SN74LVC2G08DCUTE4 TI US8 New 详细
CD74HC112M96 TI New 详细
TPS79601DRBT TI 8-SON (3x3) New 详细
LMC6042IMX/NOPB TI 8-SOIC New 详细
PTH12060WAH TI New 详细
THS1209CDAG4 TI 32-TSSOP New 详细
LMX2541SQX2380E/NOPB TI 36-WQFN (6x6) New 详细
LM2940SX-9.0 TI DDPAK/TO-263-3 New 详细