产品系列
TLV5618AQD
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Active
Number of Bits : 12
Number of D/A Converters : 2
Settling Time : 10μs
Output Type : Voltage - Buffered
Differential Output : No
Data Interface : SPI
Reference Type : External
Voltage - Supply, Analog : 2.7V ~ 3.3V, 5V
Voltage - Supply, Digital : 2.7V ~ 3.3V, 5V
INL/DNL (LSB) : ±2, ±0.5
Architecture : String DAC
Operating Temperature : -40°C ~ 125°C
Package / Case : 8-SOIC (0.154", 3.90mm Width)
Supplier Device Package : 8-SOIC
Mounting Type : Surface Mount
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS62321YEDR | TI | 8-DSBGA (1.8x1.8) | New | 详细 | |
| INA181A3IDBVT | TI | SOT-23-6 | New | 详细 | |
| TSB42AA9APZT | TI | 100-TQFP (14x14) | New | 详细 | |
| OPA3832IDR | TI | 14-SOIC | New | 详细 | |
| TPA3124D2EVM | TI | New | 详细 | ||
| INA141UA | TI | 8-SOIC | New | 详细 | |
| LDC1000NHRR | TI | 16-WSON (5x4) | New | 详细 | |
| TPA6139A2RGTR | TI | 16-QFN (3x3) | New | 详细 | |
| THS4141IDGKRG4 | TI | 8-VSSOP | New | 详细 | |
| BQ3060PW | TI | 24-TSSOP | New | 详细 | |
| TPA2000D1EVM | TI | New | 详细 | ||
| TLC27M2BCDR | TI | 8-SOIC | New | 详细 | |
| SN74HC374N | TI | New | 详细 | ||
| MSP430F2252IYFFR | TI | 49-DSBGA (2.8x2.8) | New | 详细 | |
| TMS320C32PCM40 | TI | 144-QFP (28x28) | New | 详细 | |
| MSP430F5510IPT | TI | 48-LQFP (7x7) | New | 详细 | |
| LP3872ESX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| DEM-OPA-SSOP-3B | TI | New | 详细 | ||
| SN74LVTH16374GRDR | TI | New | 详细 | ||
| TPA6047A4RHBR | TI | 32-VQFN (5x5) | New | 详细 |
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